The DCT laser precision processing equipment has a vast amount of application experience on polytetrafluoroethylene (PTFE) based PCBs. It has a wide range of applications in direct forming of conductive patterns, complex external/internal cutouts, and process wire removal. With the increasing demand for buried passive components in PTFE substrates, the DCT DirectLaser S series devices are increasingly being used in the selective-depth-cutting processing for PTFE or other circuit board substrates.