App & Solution
Silicon nitride precise cutting
Silicon wafer drilling, cutting and blind slot making
Silicon carbide precise cutting
Semiconductor material precise cutting
DCT DirectLaser S or U series are ideal for cutting Silicon carbide (SiC), Silicon nitride (AlSiC), Aluminum silicon carbide (AlSiC), Gallium arsenide (GaAs) etc. They also can be used for making MEMS micro structure.
